C08G 59/5046
Heterocyclic
Official title: {heterocyclic}
C08G59/5046 (Heterocyclic) appears on 437 US grants and 427 published applications in this corpus.
Search patents in C08G- Granted patents
- 437
- Published applications
- 427
- Assignees
- 262
- Inventors
- 1,310
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 12 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 8 | 0 |
| 1991 | 10 | 0 |
| 1992 | 17 | 0 |
| 1993 | 14 | 0 |
| 1994 | 13 | 0 |
| 1995 | 5 | 0 |
| 1996 | 13 | 0 |
| 1997 | 7 | 0 |
| 1998 | 11 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 2 |
| 2003 | 2 | 4 |
| 2004 | 4 | 1 |
| 2005 | 2 | 4 |
| 2006 | 0 | 1 |
| 2007 | 1 | 7 |
| 2008 | 0 | 3 |
| 2009 | 3 | 7 |
| 2010 | 3 | 17 |
| 2011 | 2 | 7 |
| 2012 | 4 | 13 |
| 2013 | 6 | 16 |
| 2014 | 10 | 15 |
| 2015 | 7 | 24 |
| 2016 | 10 | 26 |
| 2017 | 19 | 30 |
| 2018 | 27 | 29 |
| 2019 | 34 | 42 |
| 2020 | 19 | 28 |
| 2021 | 22 | 33 |
| 2022 | 21 | 30 |
| 2023 | 14 | 20 |
| 2024 | 17 | 31 |
| 2025 | 14 | 22 |
| 2026 | 5 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Epoxy resin composition8 Sep 2026US 12,729,269 B2Threebond Co., Ltd.
- Resin composition, resin cured product, and fiber reinforced resin14 Jul 2026US 12,679,925 B2Hitachi, Ltd.
- Bonding method16 Jun 2026US 12,655,333 B2Nitto Denko Corporation
- High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers12 May 2026US 12,624,262 B2Ddp Specialty Electronic Materials US, LLC
- Benzoxazine compound-containing composition, curable resin composition, and cured product thereof17 Mar 2026US 12,577,346 B2Honshu Chemical Industry Co., Ltd.
- Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability24 Sep 2026US 2026/0286039 A1Sika Technology AG
- Polymer compositions with thermally contractile molecules10 Sep 2026US 2026/0265448 A1National Technology & Engineering Solutions of Sandia, LLC
- Resin composition, film, film set, optical waveguide, opto-electric composite substrate, and electronic component30 Jul 2026US 2026/0218020 A1Sumitomo Bakelite Co., Ltd.
- Insulating resin composition, cured product and electronic component16 Jul 2026US 2026/0201143 A1Namics Corporation
- Chemical-resistant protective film9 Jul 2026US 2026/0193459 A1Nissan Chemical Corporation
Most cited
By later US patents
- Epoxy curing agent and one-component (type) epoxy resin composition65US 5,837,785 ASanyo Chemical Industries, Ltd. · 1998
- Tube sheets for permeators64US 4,323,453 AMonsanto Company · 1982
- Epoxy curing agent and one-component (type) epoxy resin composition61US 6,040,398 ASanyo Chemical Industries, Ltd. · 2000
- Unitary curable resin compositions49US 4,066,625 AAmicon Corporation · 1978
- Polymeric resins derived from 1-oxa-3-aza tetraline group-containing compounds and cycloaliphatic epoxides49US 4,607,091 AGurit-Essex AG · 1986