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US 12,624,262 B2Granted
High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
AssigneeDdp Specialty Electronic Materials US, LLC
InventorsFelix Koch, Sergio Grunder, Andreas Lutz
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Abstract
One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ≥6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as dynamic impact peel resistance.
Claims16
A one-component epoxy structural adhesive comprising in admixture:
- A) at least one epoxy resin;
- B) a reactive toughener containing urethane and/or urea groups and capped isocyanate groups;
- C) one or more epoxy curing agents;
- D) 5 to 20 weight percent, based on the total weight of the epoxy structural adhesive, of a mineral filler in the form of fibers having a diameter of about 12 μm to 25 μm and an aspect ratio of at least 6, wherein the mineral filler in the form of fibers is wollastonite, and the diameter is D50 as measured by microscopy, and wherein at least 10 weight-% of component D) has an aspect ratio of at least 20 and
- E) one or more epoxy curing catalysts,
- wherein the curing agent(s) and epoxy curing catalyst(s) are selected together such that the structural adhesive exhibits a curing temperature of at least 60° C., wherein the curing temperature is the lowest temperature at which the structural adhesive achieves at least 30% of its lap shear strength according to DIN ISO 1465 at full cure within 2 hours.
3 more elements
Dependencies are inferred from the claim text.