Bonding method
AssigneeNitto Denko Corporation
InventorsAkiko Tanaka, Yuto Suzuki, Chie Hamada
Life of this patent
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Abstract
A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5<B/A<900.
Claims8
A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend, wherein
- the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer,
- a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent, and
- a thickness A (m) of the adhesive layer before curing and an application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy the expression (1) below:
- 5<B/A<900 (1).
Dependencies are inferred from the claim text.