C08G 59/40
Characterised by the curing agents used
Official title: characterised by the curing agents used
C08G59/40 (Characterised by the curing agents used) appears on 5,708 US grants and 5,067 published applications in this corpus.
Search patents in C08G- Granted patents
- 5,708
- Published applications
- 5,067
- Assignees
- 1,631
- Inventors
- 11,679
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 96 | 0 |
| 1977 | 92 | 0 |
| 1978 | 117 | 0 |
| 1979 | 83 | 0 |
| 1980 | 83 | 0 |
| 1981 | 126 | 0 |
| 1982 | 101 | 0 |
| 1983 | 110 | 0 |
| 1984 | 104 | 0 |
| 1985 | 128 | 0 |
| 1986 | 115 | 0 |
| 1987 | 127 | 0 |
| 1988 | 124 | 0 |
| 1989 | 129 | 0 |
| 1990 | 104 | 0 |
| 1991 | 118 | 0 |
| 1992 | 115 | 0 |
| 1993 | 93 | 0 |
| 1994 | 91 | 0 |
| 1995 | 75 | 0 |
| 1996 | 83 | 0 |
| 1997 | 79 | 0 |
| 1998 | 92 | 0 |
| 1999 | 100 | 0 |
| 2000 | 72 | 0 |
| 2001 | 79 | 21 |
| 2002 | 98 | 77 |
| 2003 | 97 | 94 |
| 2004 | 66 | 130 |
| 2005 | 46 | 99 |
| 2006 | 53 | 88 |
| 2007 | 44 | 124 |
| 2008 | 40 | 109 |
| 2009 | 60 | 155 |
| 2010 | 74 | 217 |
| 2011 | 114 | 184 |
| 2012 | 103 | 212 |
| 2013 | 126 | 207 |
| 2014 | 123 | 206 |
| 2015 | 132 | 248 |
| 2016 | 167 | 267 |
| 2017 | 187 | 259 |
| 2018 | 189 | 244 |
| 2019 | 205 | 276 |
| 2020 | 199 | 268 |
| 2021 | 195 | 298 |
| 2022 | 157 | 291 |
| 2023 | 164 | 250 |
| 2024 | 158 | 269 |
| 2025 | 168 | 267 |
| 2026 | 107 | 207 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Epoxy resin curing agent, epoxy resin composition, and paint6 Oct 2026US 12,753,270 B2Mitsubishi Gas Chemical Company, Inc.
- Methods of treating unconsolidated sand formations using a red mud sealant composition6 Oct 2026US 12,753,339 B2Saudi Arabian Oil Company
- Fabrication process for polymer-based bipolar batteries via in-situ polymerization6 Oct 2026US 12,756,006 B2GM Global Technology Operations LLC
- Curing agent, method of producing curing agent, and curable composition29 Sep 2026US 12,747,349 B2Dexerials Corporation
- Low density flame retardant two-component composition for structural void filling15 Sep 2026US 12,735,527 B2Zephyros, Inc.
- Epoxy resin composition particle, tablet, and method for producing columnar tablet1 Oct 2026US 2026/0297243 A1Sumitomo Bakelite Co., Ltd.
- Syntactic foam compositions1 Oct 2026US 2026/0297388 A1PRC-DeSoto International, Inc.
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
- Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability24 Sep 2026US 2026/0286039 A1Sika Technology AG
- Heat-curing epoxy resin composition having high storage stability24 Sep 2026US 2026/0286200 A1Sika Technology AG
Most cited
By later US patents
- Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials165US 4,256,828 AMinnesota Mining and Manufacturing Company · 1981
- Flexible poly(amino ethers) for barrier packaging158US 5,464,924 AThe Dow Chemical Company · 1995
- Process for electrodepositing cationic compositions143US 3,984,299 APPG Industries, Inc. · 1976
- 4,4'-Isopropylidene-bis(3- and 4-phenyleneoxyphthalic anhydride)129US 3,972,902 AGeneral Electric Company · 1976
- Heat-curable, thermally expandable moulded park127US 6,573,309 B1Henkel-Teroson GmbH · 2003