Heat-curing epoxy resin composition having high storage stability
AssigneeSika Technology AG
InventorsFabio GABERELL, Andri SCHÜTZ, Christian KRÜGER, Dusko PARIPOVIC, Noah MUNZINGER
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Abstract
Thermosetting epoxy resin compositions which on the one hand have high storage stability and nevertheless also have satisfactory mechanical properties. The one-component thermosetting epoxy resin composition includes a) at least one epoxy resin A having an average of more than one epoxy group per molecule; b) porous particles PP, preferably silica particles PS, which have incorporated in the pores at least one component ComP which is: i) a curing agent for epoxy resins B, or ii) an accelerator C for curing agents for epoxy resins.
Claims15
A one-component thermosetting epoxy resin composition comprising
- a) at least one epoxy resin A having an average of more than one epoxy group per molecule;
- b) porous particles PP, selected from the group consisting of zeolite particles, perlite particles, phonolite particles, calcium silicate particles, silica particles PS, foamed polyurethane particles, expanded vermiculite particles, fumed metal oxide particles, and kieselguhr particles,
- which have incorporated in the pores at least one component ComP which is:
- i) a curing agent for epoxy resins B, or
- ii) an accelerator C for curing agents for epoxy resins.
Dependencies are inferred from the claim text.