C08G 59/4007
Curing agents not provided for by the groups c08g59/42 - c08g59/66
Official title: {Curing agents not provided for by the groups C08G59/42 - C08G59/66}
C08G59/4007 (Curing agents not provided for by the groups c08g59/42 - c08g59/66) appears on 1,546 US grants and 1,398 published applications in this corpus.
Search patents in C08G- Granted patents
- 1,546
- Published applications
- 1,398
- Assignees
- 687
- Inventors
- 3,971
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 30 | 0 |
| 1977 | 28 | 0 |
| 1978 | 27 | 0 |
| 1979 | 28 | 0 |
| 1980 | 27 | 0 |
| 1981 | 39 | 0 |
| 1982 | 40 | 0 |
| 1983 | 40 | 0 |
| 1984 | 36 | 0 |
| 1985 | 33 | 0 |
| 1986 | 26 | 0 |
| 1987 | 30 | 0 |
| 1988 | 28 | 0 |
| 1989 | 34 | 0 |
| 1990 | 31 | 0 |
| 1991 | 39 | 0 |
| 1992 | 31 | 0 |
| 1993 | 22 | 0 |
| 1994 | 30 | 0 |
| 1995 | 15 | 0 |
| 1996 | 18 | 0 |
| 1997 | 11 | 0 |
| 1998 | 21 | 0 |
| 1999 | 23 | 0 |
| 2000 | 23 | 0 |
| 2001 | 13 | 6 |
| 2002 | 27 | 15 |
| 2003 | 21 | 21 |
| 2004 | 15 | 27 |
| 2005 | 10 | 28 |
| 2006 | 15 | 21 |
| 2007 | 8 | 23 |
| 2008 | 7 | 23 |
| 2009 | 4 | 27 |
| 2010 | 14 | 60 |
| 2011 | 31 | 56 |
| 2012 | 25 | 45 |
| 2013 | 31 | 68 |
| 2014 | 31 | 46 |
| 2015 | 39 | 71 |
| 2016 | 49 | 56 |
| 2017 | 39 | 50 |
| 2018 | 43 | 84 |
| 2019 | 60 | 81 |
| 2020 | 57 | 76 |
| 2021 | 57 | 114 |
| 2022 | 52 | 91 |
| 2023 | 61 | 81 |
| 2024 | 51 | 88 |
| 2025 | 46 | 79 |
| 2026 | 30 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curing agent, method of producing curing agent, and curable composition29 Sep 2026US 12,747,349 B2Dexerials Corporation
- One component polymerizable composition for trickle impregnation1 Sep 2026US 12,723,129 B2Huntsman Advanced Materials (Switzerland) GmbH
- Epoxy curing agents and uses thereof25 Aug 2026US 12,715,957 B2Evonik Operations GmbH
- Two component coating compositions16 Jun 2026US 12,655,247 B2PPG Industries Ohio, Inc.
- Aqueous dispersions containing cationic polyvinyl alcohol modified polymer particles and aqueous electrocoating materials containing said dispersions16 Jun 2026US 12,655,283 B2BASF Coatings GmbH
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
- Heat-curing epoxy resin composition having high storage stability24 Sep 2026US 2026/0286200 A1Sika Technology AG
- Implantable medical devices with photocurable feedthrough potting adhesives and methods of manufacture17 Sep 2026US 2026/0273289 A1
- Structural Adhesives Cured By Polycarbonate10 Sep 2026US 2026/0265591 A1Zephyros, Inc.
- One component composition based on epoxy resins10 Sep 2026US 2026/0265592 A1Henkel AG & Co. KGaA
Most cited
By later US patents
- Heat-curable, thermally expandable moulded park127US 6,573,309 B1Henkel-Teroson GmbH · 2003
- Activatable material115US 6,846,559 B2L&L Products, Inc. · 2005
- Method of preparing layered silicate-epoxy nanocomposites92US 5,554,670 ACornell Research Foundation, Inc. · 1996
- Quaternary ammonium salt-containing resin compositions83US 3,962,165 APPG Industries, Inc. · 1976
- Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer72US 4,657,986 AKanegafuchi Chemical Industry Co., Ltd. · 1987