C08G 59/4078
Boron containing compounds
Official title: {boron containing compounds}
C08G59/4078 (Boron containing compounds) appears on 39 US grants and 28 published applications in this corpus.
Search patents in C08G- Granted patents
- 39
- Published applications
- 28
- Assignees
- 20
- Inventors
- 72
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 2 | 3 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 2 | 3 |
| 2019 | 2 | 3 |
| 2020 | 2 | 2 |
| 2021 | 0 | 2 |
| 2022 | 5 | 1 |
| 2023 | 0 | 3 |
| 2024 | 0 | 2 |
| 2025 | 2 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Snap-cure flexible electrically conductive one component (1K) epoxy adhesive composition10 Feb 2026US 12,545,818 B2Henkel AG & Co. KGaA
- Resin composition30 Sep 2025US 12,428,553 B2Segi Enc Co., Ltd.
- Epoxy resin composition, intermediate substrate, and fiber-reinforced composite material4 Mar 2025US 12,240,975 B2Toray Industries, Inc.
- Impregnation resin mixture16 Aug 2022US 11,414,542 B2
- Epoxy resin composition, prepreg, and fiber-reinforced composite material31 May 2022US 11,345,808 B2Toray Industries, Inc.
- Resin composition for optical waveguides, dry film for optical waveguides, and optical waveguide3 Jul 2025US 2025/0215148 A1Panasonic Intellectual Property Management Co., Ltd.
- Snap-cure flexible electrically conductive one component (1k) epoxy adhesive composition6 Mar 2025US 2025/0075109 A1Henkel AG & Co. KGaA
- Reversible Epoxy Polymer with Dynamic Boronic Bond10 Oct 2024US 2024/0336724 A1
- Resin composition for optical waveguide, and dry film and optical waveguide using same26 Sep 2024US 2024/0317930 A1Panasonic Intellectual Property Management Co., Ltd.
- Near-infrared (nir) sensitized adhesive and sealant compositions21 Dec 2023US 2023/0407151 A1Henkel AG & Co. KGaA
Most cited
By later US patents
- Quaternary ammonium salt-containing resin compositions83US 3,962,165 APPG Industries, Inc. · 1976
- Electrodepositable compositions54US 3,937,679 APPG Industries, Inc. · 1976
- Method of producing epoxy group-containing, quaternary ammonium salt-containing resins49US 4,001,156 APPG Industries, Inc. · 1977
- Boron-containing, quaternary ammonium salt-containing resin compositions48US 3,975,346 APPG Industries, Inc. · 1976
- Electrodeposition of epoxy compositions45US 4,001,101 APPG Industries, Inc. · 1977