Resin composition
AssigneesSolus Advanced Materials Co., Ltd., Segi Enc Co., Ltd.
InventorsHongsuk Kim, Chanwoo Kim, Kijung Yang
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AssigneesSolus Advanced Materials Co., Ltd., Segi Enc Co., Ltd.
InventorsHongsuk Kim, Chanwoo Kim, Kijung Yang
Estimating the term…
The present invention relates to a resin composition and an epoxy resin composition for display comprising the resin composition. More particularly, the present invention provides a transparent epoxy material that can be applied by various methods such as ink-jetting, dispensing, etc. to fill a gap by spraying a low-viscosity liquid and then be cured. The transparent epoxy material generates a little amount of gas during curing, has high reliability at high temperature and high humidity after curing so that there is no cracking between layers, and can be used in applications such as molding and bonding of glass parts of organic or inorganic light emitting display. The epoxy resin composition according to the present invention not only has excellent processability and excellent electrical, mechanical, and chemical properties of the existing liquid epoxy material, and but also as good optical properties, thereby providing workability, productivity, and reliability to a user working on packaging of organic light emitting displays.
A resin composition comprising a first epoxy resin, a second epoxy resin, and a thermal curing agent,
Dependencies are inferred from the claim text.