Near-infrared (nir) sensitized adhesive and sealant compositions

Abstract

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. % of a) at least one oxetane compound according to Formula (1) below: wherein: R1 and R2 are H, C1-C6 alkyl, C6-C18 aryl or C7-C18 aralkyl; each R3 is independently a C1-C12 alkylene group, C6-C18 arylene group, C2-C12 alkenylene group or a poly(C1-C6 alkyleneoxy) group; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt % of c) at least one ionic photoacid generator; from 0 to 10 wt. % of d) at least one free radical photoinitiator; from 0.01 to 5 wt. % of e) at least one near-infrared absorbing dye; and, from 50 to 90 wt. % of f) particulate filler.

Dependencies are inferred from the claim text.