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US 6,573,309 B1Granted
Heat-curable, thermally expandable moulded park
AssigneeHenkel-Teroson GmbH
InventorsDirk Reitenbach, Xaver Muenz
Life of this patent
Estimating the term…
Abstract
Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably contain hollow glass microspheres, are capable of providing foams which are useful in the manufacture of reinforced structural members.
Claims31
A thermosetting, thermally-expandable molded body comprising:
- (a) at least one solid reactive resin selected from the group consisting of (i) solid polyglycidyl ethers of polyphenols, polyalcohols and diamines, (ii) solid polyglycidyl esters of polycarboxylic acids, and mixtures thereof,
- (b) at least one liquid reactive resin selected from the group consisting of (i) liquid polyglycidyl ethers of polyphenols, polyalcohols and diamines, (ii) liquid polyglycidyl esters of polycarboxylic acids, and mixtures thereof,
- (c) at least one reactive resin conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of amino-terminated polyoxyalkylenes and polyepoxides, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polymercaptan-modified epoxy resins, polysulfide-modified epoxy resins, and mixtures thereof,
- (d) at least one additive selected from the group consisting of latent hardeners and accelerators, and
- (e) at least one expanding agent.
2 more elements
A molded body comprising:
- (a) one or more solid epoxy resins selected from the group consisting of (i) solid polyglycidyl ethers of polyphenols, polyalcohols, and diamines, (ii) solid polyglycidyl esters of polycarboxylic acids, and mixtures thereof from 25 to 50 wt. %
- (b) one or more liquid epoxy resins selected from the group consisting of (i) liquid polyglycidyl ethers of polyphenols, polyalcohols, and diamines, (ii) liquid polyglycidyl esters of polycarboxylic acids, and mixtures thereof from 10 to 50 wt. %
- (c) one or more epoxy resins conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of amino-terminated polyoxyalkylenes and polyepoxides, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polymercaptan-modified epoxy resins, polysulfide-modified epoxy resins, and mixtures thereof from 1 to 25 wt. %
- (d) one or more additives selected from the from 1.5 to 5 wt. % group consisting of hardeners and accelerators (e) one or more expanding agents from 0.5 to 5 wt. % (f) one or more lightweight fillers from 20 to 40 wt. % (g) one or more fillers other than lightweight filler from 5 to 20 wt. % (h) one or more fibers from 0.1 to 5 wt. % (i) one or more pigments from 0 to 1 wt. %,
- the sum of all the constituents being 100 wt. %, wherein said molded body is non-tacky and dimensionally stable at room temperature.
2 more elements
A method of rigidifying and/or reinforcing a structure having a hollow space, said method comprising:
- (i) molding a mixture comprised of
- (a) at least one solid epoxy resin selected from the group consisting of solid polyglycidyl ethers of polyphenols, polyalcohols and diamines, solid polyglycidyl esters of polycarboxylic acids, and mixtures thereof;
- (b) at least one liquid epoxy resin selected from the group consisting of liquid polyglycidyl ethers of polyphenols, polyalcohols and diamines, liquid polyglycidyl esters of polycarboxylic acids, and mixtures thereof;
- (c) at least one reactive resin conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polymercaptan-modified epoxy resins, polysulfide-modified epoxy resins and mixtures thereof;
- (d) at least one additive selected from the group consisting of hardeners and accelerators;
- and
- (e) at least one expanding agent;
- at a temperature of 60° C. to 110° C. to form a molded body;
- (ii) cooling the molded body;
- (iii) introducing said molded body to said hollow space of said structure;
- (iv) heating said molded body to a temperature of from 110° C. to 200° C., whereupon the volume of the molded body expands and the molded body hardens to a thermoset.
8 more elements
A method of rigidifying and/or reinforcing a substrate, said method comprising:
- (i) molding a mixture comprised of
- (a) at least one solid epoxy resin selected from the group consisting of solid polyglycidyl ethers of polyphenols, polyalcohols and diamines, solid polyglycidyl esters of polycarboxlic acids, and mixtures thereof;
- (b) at least one liquid epoxy resin selected from the group consisting of liquid polyglycidyl ethers of polyphenols, polyalcohols and diamines, liquid polyglycidyl esters of polycarboxylic acids, and mixtures thereof;
- (c) at least one reactive resin conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of amino-terminated polyoxyalkylenes and polyepoxides, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polymercaptan-modified epoxy resins, polysulfide-modified epoxy resins and mixtures thereof;
- (d) at least one additive selected from the group consisting of hardeners and accelerators;
- and
- (e) at least one expanding agent;
- form a molded body;
- (ii) cooling the molded body;
- (iii) applying said molded body to said substrate;
- and
- (iv) heating said molded body to a temperature of from 110° C. to 200 C., whereupon the volume of the molded body expands and the molded body hardens to a thermoset.
9 more elements
A thermosetting, thermally-expandable molded body which is dimensionally stable and not tacky at room temperature comprising:
- (a) at least one liquid epoxy resin which is a liquid polyglycidyl ether of a polyphenol and which has an epoxy equivalent weight of 150 to 480;
- (b) at least one solid epoxy resin which is a solid polyglycidyl ether of a polyphenol and which has a melting point of from 45° C. to 90° C.;
- (c) at least one reactive resin conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of amino-terminated polyoxyalkylenes and polyepoxides, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polysulfide-modified epoxy resins, polymercaptan-modified epoxy resins and mixtures thereof:
- (d) at least one latent hardener or accelerator selected from the group consisting of guanidines, substituted guanidines, substituted ureas, melamine resins, guanamine derivatives, cyclic tertiary amines, aromatic amines, imidazole derivatives, and mixtures thereof;
- (e) at least one expanding agent selected from the group consisting of azo compounds, hydrazides, and expandable hollow plastic microspheres;
- and
- (f) at least one light weight filler selected from the group consisting of hollow glass microspheres, flue ash, hollow plastic spheres, hollow ceramic spheres, organic lightweight fillers of natural origin, and mixtures thereof.
4 more elements
A thermosetting, thermally-expandable molded body which is dimensionally stable and not tacky at room temperature comprising:
- (a) at leat one liquid epoxy resin obtained by reaction of bisphenol A and epichlorohydrin and having an epoxy equivalent weight of from 182 to 350;
- (b) at least one solid epoxy resin obtained by reaction of bisphenol A and epichlorohydrin and having a melting point from 50° C. to 80° C. and an epoxy equivalent weight of from 450 to 900;
- (c) at least one reactive resin conferring flexibility selected from the reaction products of polymeric fatty acids with diglycidyl ethers of bisphenol A;
- (d) at least one latent hardener or accelerator selected from substituted guanidines;
- (e) expandable plastic microspheres;
- and
- (f) hollow glass microspheres.
4 more elements
A method of rigidifying and/or reinforcing a metal component, said method comprising applying a molded body which is non-tacky and dimensionally stable at room temperature and comprised of
- (a) at least one solid reactive resin selected from the group consisting of (i) solid polyglycidyl ethers of polyphenols, polyalcohols, and diamines, (ii) solid polyglycidyl esters of polycarboxylic acids, and mixtures thereof;
- (b) at least one liquid reactive resin selected from the group consisting of (i) liquid polyglycidyl ethers of polyphenols, polyalcohols, and diamines, (ii) liquid polyglycidyl esters of polycarboxylic acids, and mixtures thereof;
- (c) at least one reactive resin conferring flexibility selected from the group consisting of rubber-modified epoxy resins, polyurethane-modified epoxy resins, adducts of amino-terminated polyoxyalkylenes and polyepoxides, adducts of polymeric fatty acids and epichlorohydrin, glycidol, or diglycidyl ethers of bisphenol A, adducts of polyether polyols with epoxy resins, polymercaptan-modified epoxy resins, polysulfide-modified epoxy resins, and mixtures thereof;
- (d) at least one additive selected from the group consisting of hardeners and accelerators;
- and
- (e) at least one expanding agent,
- to said metal component and heating said molded body to a temperature effective to expand said molded body in volume and to harden said molded body to a thermoset.
4 more elements
Dependencies are inferred from the claim text.