C08G 59/4014
Nitrogen containing compounds
Official title: {Nitrogen containing compounds}
C08G59/4014 (Nitrogen containing compounds) appears on 1,076 US grants and 994 published applications in this corpus.
Search patents in C08G- Granted patents
- 1,076
- Published applications
- 994
- Assignees
- 500
- Inventors
- 2,885
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 15 | 0 |
| 1978 | 19 | 0 |
| 1979 | 19 | 0 |
| 1980 | 16 | 0 |
| 1981 | 22 | 0 |
| 1982 | 18 | 0 |
| 1983 | 30 | 0 |
| 1984 | 24 | 0 |
| 1985 | 25 | 0 |
| 1986 | 21 | 0 |
| 1987 | 22 | 0 |
| 1988 | 25 | 0 |
| 1989 | 22 | 0 |
| 1990 | 24 | 0 |
| 1991 | 30 | 0 |
| 1992 | 22 | 0 |
| 1993 | 17 | 0 |
| 1994 | 26 | 0 |
| 1995 | 11 | 0 |
| 1996 | 15 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 16 | 0 |
| 2000 | 16 | 0 |
| 2001 | 8 | 4 |
| 2002 | 21 | 11 |
| 2003 | 12 | 15 |
| 2004 | 8 | 17 |
| 2005 | 6 | 18 |
| 2006 | 11 | 16 |
| 2007 | 4 | 16 |
| 2008 | 4 | 14 |
| 2009 | 2 | 19 |
| 2010 | 9 | 42 |
| 2011 | 17 | 42 |
| 2012 | 16 | 36 |
| 2013 | 22 | 47 |
| 2014 | 21 | 32 |
| 2015 | 27 | 47 |
| 2016 | 36 | 37 |
| 2017 | 22 | 37 |
| 2018 | 32 | 52 |
| 2019 | 43 | 52 |
| 2020 | 38 | 62 |
| 2021 | 41 | 94 |
| 2022 | 42 | 68 |
| 2023 | 47 | 53 |
| 2024 | 41 | 62 |
| 2025 | 32 | 56 |
| 2026 | 22 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- One component polymerizable composition for trickle impregnation1 Sep 2026US 12,723,129 B2Huntsman Advanced Materials (Switzerland) GmbH
- Epoxy curing agents and uses thereof25 Aug 2026US 12,715,957 B2Evonik Operations GmbH
- Two component coating compositions16 Jun 2026US 12,655,247 B2PPG Industries Ohio, Inc.
- Aqueous dispersions containing cationic polyvinyl alcohol modified polymer particles and aqueous electrocoating materials containing said dispersions16 Jun 2026US 12,655,283 B2BASF Coatings GmbH
- Composition2 Jun 2026US 12,644,031 B2Kansai Helios Austria GmbH
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
- Heat-curing epoxy resin composition having high storage stability24 Sep 2026US 2026/0286200 A1Sika Technology AG
- One component composition based on epoxy resins10 Sep 2026US 2026/0265592 A1Henkel AG & Co. KGaA
- Coupling agents27 Aug 2026US 2026/0250435 A1Lubrizol Advanced Materials, Inc.
- Curable Resin Composition and Adhesive Composition27 Aug 2026US 2026/0250504 A1Kuk Do Chemical Co., Ltd.
Most cited
By later US patents
- Heat-curable, thermally expandable moulded park127US 6,573,309 B1Henkel-Teroson GmbH · 2003
- Activatable material115US 6,846,559 B2L&L Products, Inc. · 2005
- Blend of tris (cyanatophenyl) alkane and bis(cyanatophenyl) alkane69US 4,709,008 AInterez, Inc. · 1987
- High temperature three dimensional printing compositions65US 9,708,440 B2Novoset, LLC · 2017
- Cationic electrodepositable compositions53US 4,101,486 APPG Industries, Inc. · 1978