C08G 59/4042
Imines
Official title: {Imines; Imides}
C08G59/4042 (Imines) appears on 256 US grants and 167 published applications in this corpus.
Search patents in C08G- Granted patents
- 256
- Published applications
- 167
- Assignees
- 156
- Inventors
- 624
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 6 | 0 |
| 1978 | 8 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 8 | 0 |
| 1982 | 7 | 0 |
| 1983 | 13 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 15 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 7 |
| 2003 | 7 | 5 |
| 2004 | 4 | 8 |
| 2005 | 2 | 6 |
| 2006 | 1 | 6 |
| 2007 | 2 | 3 |
| 2008 | 1 | 3 |
| 2009 | 0 | 7 |
| 2010 | 1 | 13 |
| 2011 | 8 | 6 |
| 2012 | 3 | 4 |
| 2013 | 7 | 11 |
| 2014 | 3 | 4 |
| 2015 | 2 | 8 |
| 2016 | 2 | 2 |
| 2017 | 4 | 6 |
| 2018 | 6 | 4 |
| 2019 | 6 | 4 |
| 2020 | 2 | 9 |
| 2021 | 7 | 10 |
| 2022 | 3 | 6 |
| 2023 | 9 | 1 |
| 2024 | 5 | 5 |
| 2025 | 3 | 18 |
| 2026 | 2 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Two component coating compositions16 Jun 2026US 12,655,247 B2PPG Industries Ohio, Inc.
- Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board17 Feb 2026US 12,552,926 B2Panasonic Intellectual Property Management Co., Ltd.
- Structural adhesive compositions23 Sep 2025US 12,421,431 B2PPG Industries Ohio, Inc.
- Powder coating formulations and methods thereof22 Jul 2025US 12,365,006 B2IFS Coatings, Inc.
- Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package18 Mar 2025US 12,256,490 B2Resonac Corporation
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
- Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same30 Jul 2026US 2026/0218021 A1Shin-Etsu Chemical Co., Ltd.
- Curable resin composition for solder resist use18 Jun 2026US 2026/0166660 A1Shin-Etsu Chemical Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
- Moisture and heat-curable sealing composition21 May 2026US 2026/0139170 A1Sika Technology AG
Most cited
By later US patents
- Heat-resistant laminating resin composition and method for using same38US 3,985,928 ASumitomo Bakelite Co., Ltd. · 1976
- Bis-maleimide-epoxy compositions and prepregs38US 4,510,272 AAvco Corporation · 1985
- Epoxide resin mixtures35US 4,127,615 ACiba-Geigy Corporation · 1978
- Multi-layer printed circuit board and process for production thereof34US 4,526,835 AHitachi, Ltd. · 1985
- Polymers derived from allylphenol or substituted allylphenol and maleic anhydride33US 4,388,451 AAshland Oil, Inc. · 1983