Bis-maleimide-epoxy compositions and prepregs
AssigneeAvco Corporation
InventorRaymond C. Loszewski
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AssigneeAvco Corporation
InventorRaymond C. Loszewski
Estimating the term…
A novel composition is described comprising an admixture of an unsaturated polyimide prepolymer essentially free of terminal amine groups and an epoxy resin having a homopolymerization temperature that is greater than the temperature at which the polyimide polymerizes. These compositions maintain the superior glass transition temperatures and moisture resistance of the polyimide while picking up the desirable handling properties of the epoxy. These compositions have excellent high temperature and moisture resistant properties and excellent storage stability. For instance, carbon composites made with these materials have exhibited 60% shear property retention at 450.degree. F. after being boiled in water for one week. Also described are prepregs comprising the novel composition, methods for curing the novel composition to obtain the superior properties, and articles of manufacture comprising the novel composition.
A resinous composition comprising an admixture of an unsaturated polyimide essentially free of terminal amine groups and an epoxy having a homopolymerization temperature greater than the temperature at which the polyimide polymerizes.
A cured composition comprised of an admixture of an unsaturated polyimide essentially free of terminal amine groups and epoxy resin wherein said admixture of said polyimide and said epoxy resin has been heated to temperature for a period of time sufficient to polymerize said polyimide but not sufficient to substantially homopolymerize said epoxy resin and, after such polymerization of said polyimide, said admixture has been further heated to a higher temperature for a period of time sufficient to cause said epoxy resin to polymerize.
A prepreg comprising a fibrous material coated or impregnated with a composition comprising an admixture of an unsaturated polyimide essentially free of terminal amine groups and an epoxy having a homopolymerization temperature greater than the temperature at which the polyimide polymerizes.
An article of manufacture comprising a cured composition comprising an admixture of an unsaturated polyimide essentially free of terminal amine groups and an epoxy having a homopolymerization temperature greater than the temperature at which the polyimide polymerizes, wherein said article is cured by heating said article at a first temperature to polymerize said polyimide while said epoxy functions as a diluent, and subsequently heating said at a second temperature to substantially homopolymerize said epoxy.
A process for polymerizing an unsaturated polyimide with an epoxy resin, said process comprising:
A composition comprising from 30 to 70 parts by weight of a polyimide
A composition comprising from 30 to 70 parts by weight of a polyimide having the formula:
A resinous composition comprising an admixture of an unsaturated bis-imide essentially free of terminal amine groups and an epoxy having a homopolymerization temperature greater than the temperature at which the polyimide polymerizes, wherein said bis-imide has the formula:
A resinous composition comprising an admixture of an unsaturated bis-imide essentially free of terminal amine groups and an epoxy having a viscosity less than about 10,000 cp at 120.degree. F. and a homopolymerization temperature greater than the temperature at which the polyimide polymerizes, wherein said bis-imide has the formula:
An resinous composition comprising an admixture of an unsaturated polyimide essentially free of terminal amine groups and a a glycidyl amine epoxy having a viscosity less than about 10,000 cp at 120.degree. F. and a homopolymerization temperature greater than the temperature at which the polyimide polymerizes.
A resinous composition comprising an admixture of an unsaturated polyimide essentially free of terminal amine groups and an epoxy having a viscosity less than about 10,000 cp at 120.degree. F. and a homopolymerization temperature greater than the temperature at which the polyimide polymerizes.
Dependencies are inferred from the claim text.