Curable resin composition for solder resist use

Abstract

Provided is a curable resin composition for solder resist use containing: (A) a bismaleimide compound represented by formula (1) defined as wherein, in the formula (1), each A independently represents a tetravalent organic group having a cyclic structure, each B independently represents a divalent hydrocarbon group derived from a dimer acid skeleton, each Q independently represents a divalent hydrocarbon group having an alicyclic structure or a divalent hydrocarbon group having an aromatic ring, W is B or Q, n is a number of 1 to 100, m is a number of 1 to 100, and repeating units in square brackets with subscripts n and m are arranged in any order; (B) a citraconimide compound; (C) an epoxy resin; (D) a curing accelerator; and (E) an inorganic filler.

Dependencies are inferred from the claim text.