Multi-layer printed circuit board and process for production thereof

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been preprared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg.sub.1) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg.sub.2) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, and wherein the resin composition for at least the prepreg resin sheet comprises:

• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula ##STR7## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms,
• (II) an epoxy resin, and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR8## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg.sub.1) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg.sub.2) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, and wherein the resin composition for at least the prepreg resin sheet comprises:

• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula ##STR9## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms,
• (II) an epoxy resin, and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR10## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg.sub.2) of the resin after cured, said Tg.sub.2 being 170.degree. C. or higher, and wherein the resin composition comprises:

• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula:
• ##STR11## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms,
• (II) an epoxy resin, and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR12## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg.sub.2) of the resin after cured, said Tg.sub.2 being 170.degree. C. or higher, and

• wherein the resin composition comprises:
• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula:
• ##STR14## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms,
• (II) an epoxy resin, and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR15## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

A combined material system for producing a multi-layer printed circuit board comprising:

• (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg.sub.1) of 170.degree. C. or higher, and
• (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and the glass transition temperature (Tg.sub.2) of the resin in the prepreg resin sheet after cured, said Tg.sub.2 being 170.degree. C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises:
• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula:
• ##STR16## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms;
• (II) an epoxy resin;
• and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR17## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

A combined material system for producing a multi-layer printed circuit board comprising:

• (i) at least one unit cirucuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg.sub.1) of 170.degree. C. or higher, and
• (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and the glass transition temperature (Tg.sub.2) of the resin in the prepreg resin sheet after cured, said Tg.sub.2 being 170.degree. C. or higher, and wherein the unit circuit sheet contains a polyimide resin and the prepreg resin sheet contains a resin composition comprising:
• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula:
• ##STR18## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms;
• and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms,
• (II) an epoxy resin, and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR19## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

A combined material system for producing a multi-layer printed circuit board comprising:

• (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg.sub.1) of 170.degree. C. or higher, and
• (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and the glass transition temperature (Tg.sub.2) of the resin in the prepreg resin sheet after cured, said Tg.sub.2 being 170.degree. C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises:
• (I) a prepolymer obtained by preliminarily reacting with heating
• (a) a bisimide of the formula:
• ##STR20## wherein R is a divalent organic group having at least one carbon-carbon double bond;
• and R.sub.1 is a divalent organic group having at least two carbon atoms, and
• (b) a diamine of the formula:
• H.sub.2 N--R.sub.2 --NH.sub.2 ( 2)
• wherein R.sub.2 is a divalent organic group having at least two carbon atoms;
• (II) an epoxy resin;
• and
• (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula:
• ##STR21## wherein R.sub.3, R.sub.4 and R.sub.5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R.sub.3, R.sub.4 and R.sub.5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins, and cyanate resins.