Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

A resin composition containing:

• a curable resin (A);
• an acrylic-monomer copolymer (B) having a structure expressed by the following formulae (1), (2), and (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000:
• an inorganic filler (C), where a molybdenum compound is present on at least a part of a surface of the inorganic filler (C);
• and
• another inorganic filler (D) different from the inorganic filler (C),
• the curable resin (A) including a maleimide compound (A2) and an oxazine compound (A3), and
• a content of the maleimide compound (A2) being equal to or greater than 50 parts by mass and equal to or less than 77 parts by mass with respect to 100 parts by mass in total of the maleimide compound (A2) and the oxazine compound (A3),
• wherein
• x, y, and z in the formulae (1) to (3) represent mole fractions and satisfy x+y+z≤1, 0<x≤0.2, 0.6≤y≤0.95, and 0.05≤z≤0.2,
• in the formula (2), R1 is either a hydrogen atom or a methyl group, and R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group, and
• in the formula (3), R3 is either a hydrogen atom or a methyl group, and R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph.