C08G 59/44
Amides
C08G59/44 (Amides) appears on 169 US grants and 161 published applications in this corpus.
Search patents in C08G- Granted patents
- 169
- Published applications
- 161
- Assignees
- 121
- Inventors
- 547
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 2 |
| 2006 | 0 | 3 |
| 2007 | 2 | 3 |
| 2008 | 2 | 2 |
| 2009 | 1 | 4 |
| 2010 | 0 | 5 |
| 2011 | 3 | 6 |
| 2012 | 4 | 6 |
| 2013 | 6 | 7 |
| 2014 | 2 | 5 |
| 2015 | 2 | 9 |
| 2016 | 6 | 9 |
| 2017 | 6 | 11 |
| 2018 | 5 | 11 |
| 2019 | 12 | 8 |
| 2020 | 10 | 9 |
| 2021 | 2 | 12 |
| 2022 | 4 | 9 |
| 2023 | 8 | 10 |
| 2024 | 5 | 12 |
| 2025 | 5 | 8 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Storage stable epoxy resin composition7 Jul 2026US 12,674,039 B2Alzchem Trostberg GmbH
- Powder for an electrically insulating coating26 May 2026US 12,637,585 B2Arkema France
- Liner for pressure vessel and high-pressure gas storage tank19 May 2026US 12,630,680 B2Mitsubishi Gas Chemical Company, Inc.
- Thermosetting material for use in additive manufacturing24 Mar 2026US 12,583,174 B2Tiger Coatings GmbH & Co. KG
- Polyamideimide resin composition and method for producing polyamideimide resin17 Feb 2026US 12,552,960 B2Resonac Corporation
- Curable and debondable two-part 2(k) thermally conductive adhesive composition9 Jul 2026US 2026/0193499 A1Henkel AG & Co. KGaA
- Arylated and non-arylated fat-based epoxy polymers7 May 2026US 2026/0125509 A1
- Two-component epoxy adhesive for liquified natural gas containers7 May 2026US 2026/0125584 A1Sika Technology AG
- Thermosetting resin composition and cured product19 Mar 2026US 2026/0078256 A1Polyplastics-Evonik Corporation
- Low-density anti-corrosion primer with strong adhesion to heavy flash rust surface and preparation method thereof12 Feb 2026US 2026/0042916 A1Marine Chemical Research Institute Co., Ltd.
Most cited
By later US patents
- Epoxy resin fortifiers based on aromatic amides73US 4,480,082 ACanadian Patents and Development Limited · 1984
- Curable, partially advanced epoxy resins55US 4,594,291 AThe Dow Chemical Company · 1986
- Powder coating curing system containing a beta-hydroxyalkylamide39US 4,889,890 APPG Industries, Inc. · 1989
- Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems33US 5,212,261 AHenkel Research Corporation · 1993
- Hydroxy-functional poly(ether sulfonamides) as thermoplastic barrier resins31US 5,149,768 AThe Dow Chemical Company · 1992