Curable, partially advanced epoxy resins
AssigneeThe Dow Chemical Company
InventorsJames L. Bertram, Louis L. Walker, Jody R. Berman, James A. Clarke
Life of this patent
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Abstract
Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.
Claims94
A partially advanced epoxy resin composition comprising a product resulting from reacting a composition comprising
- (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule;
- (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups;
- (C)
- (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B);
- (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles;
- or
- (3) a combination of (1) and (2);
- and
- (D) one or more stabilizer materials;
- wherein
- (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A);
- from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A);
- from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A);
- the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1 and component (D) is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage;
- and
- (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is greater than about 20 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D) with the proviso that said partially advanced composition is melt flowable at or below about 250.degree. C. and if said increase in melt viscosity is greater than about 1250 percent, a solvent is required.
A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising
- (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule;
- (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups;
- (C)
- (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B);
- (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles;
- or
- (3) a combination of (1) and (2);
- and
- (D) optionally, one or more stabilizer materials;
- wherein
- (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A);
- from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1;
- from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A);
- and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage;
- and
- (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is at least about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D);
- with the proviso that said partially advanced composition is melt flowable at or below about 250.degree. C.
A partially advanced epoxy resin composition comprising a product resulting from reacting a composition comprising
- (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule;
- (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups;
- (C)
- (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B);
- (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles;
- or
- (3) a combination of (1) and (2);
- (D) one or more solvents;
- and
- (E) optionally, one or more stabilizer materials;
- wherein
- (i) components (A), (B), (C), (D) and (E) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A);
- from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A);
- from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A);
- the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1;
- component (D) is present in a quantity of from about 5 to about 90 percent by weight of the combined weight of components (A), (B), (C) and (D);
- and component (E) when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage;
- and
- (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is greater than about 20 percent greater than the melt viscosity of the initial mixture of components (A), (B) and (C) with the proviso that reacted components (A), (B) and (C) of said partially advanced composition is soluble in component (D).
A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising
- (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule;
- (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups;
- (C) a least one of
- (1) one or more catalysts for promoting the reaction between components (A) and (B);
- (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles;
- or
- (3) a combination of (1) and (2);
- and
- (D) optionally, one or more stabilizer materials;
- wherein
- (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A);
- from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1;
- from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A);
- and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage;
- and
- (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is from about 20 to about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).
Dependencies are inferred from the claim text.