C08G 59/46
Together with other curing agents
Official title: together with other curing agents
C08G59/46 (Together with other curing agents) appears on 46 US grants and 57 published applications in this corpus.
Search patents in C08G- Granted patents
- 46
- Published applications
- 57
- Assignees
- 47
- Inventors
- 176
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 1 | 3 |
| 2013 | 3 | 3 |
| 2014 | 1 | 2 |
| 2015 | 2 | 2 |
| 2016 | 3 | 3 |
| 2017 | 1 | 6 |
| 2018 | 2 | 4 |
| 2019 | 6 | 4 |
| 2020 | 5 | 5 |
| 2021 | 0 | 5 |
| 2022 | 1 | 2 |
| 2023 | 5 | 3 |
| 2024 | 1 | 1 |
| 2025 | 1 | 4 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Thermosetting material for use in additive manufacturing24 Mar 2026US 12,583,174 B2Tiger Coatings GmbH & Co. KG
- Epoxy resin composition for use as structural adhesive30 Dec 2025US 12,509,561 B2BASF SE
- Thermosetting epoxy resin composition having low curing temperature and good storage stability6 Feb 2024US 11,891,507 B2Sika Technology AG
- Epoxy compound, composition, cured product and laminate19 Sep 2023US 11,760,711 B2DIC Corporation
- Encapsulation composition for storage or confinement of waste which is toxic to health and/or the environment13 Jun 2023US 11,676,737 B2Polynt Composites France
- Curable and debondable two-part 2(k) thermally conductive adhesive composition9 Jul 2026US 2026/0193499 A1Henkel AG & Co. KGaA
- Arylated and non-arylated fat-based epoxy polymers7 May 2026US 2026/0125509 A1
- Two-component epoxy adhesive for liquified natural gas containers7 May 2026US 2026/0125584 A1Sika Technology AG
- Novel curing agent having ester and amide groups, method for preparing the same, epoxy composition, cured product, and article comprising the same25 Dec 2025US 2025/0388719 A1Korea Institute of Industrial Technology
- Toughened Two Component Epoxy Structural Adhesive16 Oct 2025US 2025/0320391 A1Zephyros, Inc.
Most cited
By later US patents
- Powder coating curing system containing a beta-hydroxyalkylamide39US 4,889,890 APPG Industries, Inc. · 1989
- Beta-hydroxyalkylamide cured acid polymer/polyepoxide powder coating20US 5,013,791 APPG Industries, Inc. · 1991
- Polyepoxide curing by polymercaptans and a reaction product of amino acids or lactams with amines17US 4,383,090 ADiamond Shamrock Corporation · 1983
- Epoxy resin curatives11US 4,518,749 ATexaco Inc. · 1985
- Method for the crosslinking of cathodically depositable coating agents10US 4,437,960 AAkzo N. V. · 1984