Curable and debondable two-part 2(k) thermally conductive adhesive composition

A curable and debondable two-part thermally conductive adhesive composition comprising

• a first part comprising
• a) an epoxy resin;
• b) from 0.1 to 20% by weight based on the total weight of the first part of an electrolyte, wherein the electrolyte is selected from the group consisting of 1-ethyl-3-methyl-imidazolium methyl sulfate, tributyl(ethyl)phosphonium diethyl phosphate, mixture of choline chloride and ethylene glycol and mixtures thereof;
• and
• c) a thermally conductive filler;
• and
• a second part comprising
• a) a curing agent;
• b) a thermally conductive filler,
• wherein the composition further comprises an electrically conductive filler,
• wherein the electrically conductive filler is one of
• i) from 0.02 to 0.3% by weight based on the total weight of the composition of carbon nanostructures or carbon nanotubes;
• or
• ii) from 12 to 17% by weight based on the total weight of the composition of spherical graphite;
• or
• iii) from 1 to 4% by weight based on the total weight of the composition of graphite flakes.