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US 4,518,749 AGranted
Epoxy resin curatives
AssigneeTexaco Inc.
InventorsHarold G. Waddill, Heinz Schulze
Life of this patent
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Abstract
An epoxy resin composition is disclosed. The composition comprises a polyepoxide and a curing amount of a bis(hydrogen maleate) derivative of a polyoxypropylenediamine. This composition when cured produces unexpectedly superior encapsulations which are more flexible and less brittle than those of the prior art.
Claims13
An epoxy resin composition comprising:
- (A) a vicinal polyepoxide having an average of at least 1.8 reactive 1,2-epoxy groups per molecule and
- (B) a curing amount of the curing agent:
- ##STR3## wherein C is carbon, N is nitrogen, H is hydrogen, O is oxygen and R is the radical
- --CH(CH.sub.3)CH.sub.2 [OCH.sub.2 CH(CH.sub.3)].sub.x --
- wherein x is an integer of from 2 to 35, and
- (C) anhydride in a weight ratio of curing agent to anhydride of 1:5 to 5:1.
3 more elements
An epoxy resin composition comprising:
- (A) a vicinal polyepoxide having an average of at least 1.8 reactive 1,2-epoxy groups per molecule and
- (B) a curing amount of the curing agent:
- ##STR4## wherein C is carbon, N is nitrogen, H is hydrogen, O is oxygen and R is the radical
- --CH(CH.sub.3)CH.sub.2 [OCH.sub.2 CH(CH.sub.3)].sub.x --
- wherein x is an integer of from 2 to 35, and
- (C) carboxylic acid in a weight ratio of curing agent to carboxylic acid of 1:5 to 5:1.
3 more elements
Dependencies are inferred from the claim text.