Back to results
US 2026/0078256 A1Published application
Thermosetting resin composition and cured product
AssigneePolyplastics-Evonik Corporation
InventorsYoshiki NAKAIE, Daisuke FUJIKI
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a thermosetting resin composition containing: a first resin which is a thermosetting resin; and resin particles containing a second resin having an amide bond.
Claims16
A thermosetting resin composition comprising:
- a first resin which is a thermosetting resin;
- and
- resin particles comprising a second resin having an amide bond,
- wherein
- the second resin comprises one or more second functional groups selected from the group consisting of an amino group, a carboxy group, an isocyanate group, and a carboxylic anhydride group,
- the first resin comprises a first functional group capable of reacting with the one or more second functional groups,
- the second resin comprises the one or more second functional groups in an amount of from 25 to 190 mmol/kg, and
- the second resin has a relative viscosity of from 1.50 to 2.50.
5 more elements
Dependencies are inferred from the claim text.