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US 2026/0286039 A1Published application
Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability
AssigneeSika Technology AG
InventorsFabio GABERELL, Juliette LEMPEREUR, Christian KRÜGER
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Abstract
Thermosetting epoxy resin compositions include, as curing agent, a dihydrazide, in combination with an imidazolium salt as an accelerator for the curing agent wherein the molar ratio of the curing agent to the accelerator is from 6-120. The compositions feature good storage stability and a low curing temperature. The epoxy resin compositions are especially suitable for use as bodywork adhesive.
Claims16
A thermosetting one-component epoxy resin composition comprising
- a) at least one epoxy resin A having an average of more than one epoxy group per molecule;
- b) at least one curing agent B for epoxy resins, where the curing agent B is a dihydrazide;
- and
- c) at least one accelerator C for the at least one curing agent B, which is an imidazolium salt of formula (V):
- in which
- R1 is an organic radical having 1 to 20 C atoms,
- R2, R3, R4, and R5 are each an H atom or an organic radical having 1 to 20 C atoms,
- X is an anion, and
- n is 1, 2, or 3;
- wherein the molar ratio of the at least one curing agent B for epoxy resins to the at least one accelerator C (B/C) is from 6-120.
7 more elements
Dependencies are inferred from the claim text.