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US 2026/0201143 A1Published application
Insulating resin composition, cured product and electronic component
AssigneeNamics Corporation
InventorsHirotatsu IKARASHI, Toshiyuki SATO
Life of this patent
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Abstract
An insulating resin composition includes: (A) inorganic particles with an average particle size (D50) of 0.02 to 0.5 μm, (B) a polyfunctional thermo-curable compound, and (C) a curing agent, wherein the insulating resin composition has a viscosity of 400 mPa-s or less as measured with an E-type viscometer at 25° C. and 50 rpm.
Claims20
An insulating resin composition comprising
- (A) inorganic particles with an average particle size (D50) of 0.02 to 0.5 μm,
- (B) a polyfunctional thermo-curable compound, and
- (C) a curing agent,
- the insulating resin composition having a viscosity of 400 mPa-s or less as measured with an E-type viscometer at 25° C. and 50 rpm.
1 more element
14-15. (canceled)
Dependencies are inferred from the claim text.