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US 12,729,269 B2Granted
Epoxy resin composition
AssigneeThreebond Co., Ltd.
InventorsJyunya Iwasawa, Kouki Mihashi
Life of this patent
Estimating the term…
Abstract
An epoxy resin composition comprising the following components (A) to (E). Component (A) is a compound containing two or more epoxy groups. Component (B) is phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms. Component (C) is an oxetane compound. Component (D) is a thiol curing agent. Component (E) is a curing accelerator.
Claims15
An epoxy resin composition comprising the following components (A) to (E):
- component (A):
- a compound containing two or more epoxy groups
- component (B):
- phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms
- component (C):
- an oxetane compound
- component (D):
- a secondary thiol curing agent
- component (E):
- a curing accelerator,
- wherein the epoxy resin composition further comprises one or more storage stabilizers selected from the group consisting of a boric acid ester, a phosphoric acid, and p-toluene sulphonic acid,
- the content of the component (B) is 1 to 100 parts by mass, the content of the component (C) is 7 to 30 parts by mass, and the content of the component (D) is 110 to 150 parts by mass, relative to 100 parts by mass of the component (A),
- a viscosity (25° C.) of the epoxy resin composition is 750 mPa·s or less, and
- a curing shrinkage rate of the epoxy resin composition is less than 5.3%.
11 more elements
An epoxy resin composition comprising the following components (A) to (E):
- component (A):
- a compound containing two or more epoxy groups
- component (B):
- phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms
- component (C):
- an oxetane compound
- component (D):
- a secondary thiol curing agent
- component (E):
- a curing accelerator,
- wherein the epoxy resin composition does not comprise an elastomer,
- the content of the component (B) is 1 to 100 parts by mass, the content of the component (C) is 7 to 30 parts by mass, and the content of the component (D) is 110 to 150 parts by mass, relative to 100 parts by mass of the component (A),
- a viscosity (25° C.) of the epoxy resin composition is 750 mPa·s or less, and
- a curing shrinkage rate of the epoxy resin composition is less than 5.3%.
11 more elements
An epoxy resin composition consisting of the following components (A) to (E) and optionally at least one additive:
- component (A):
- a compound containing two or more epoxy groups
- component (B):
- phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms
- component (C):
- an oxetane compound
- component (D):
- a secondary thiol curing agent
- component (E):
- a curing accelerator,
- wherein the epoxy resin composition further comprises one or more storage stabilizers selected from the group consisting of a boric acid ester, a phosphoric acid, and p-toluene sulphonic acid,
- the content of the component (B) is 1 to 100 parts by mass, the content of the component (C) is 7 to 30 parts by mass, and the content of the component (D) is 110 to 150 parts by mass relative to 100 parts by mass of the component (A),
- the at least one additive is selected from the group consisting of an inorganic filler, an organic filler, a pigment, a dye, a silane coupling agent, a levelling agent, a rheology controller, and a storage stabilizer,
- a viscosity (25° C.) of the epoxy resin composition is 750 mPa·s or less, and
- a curing shrinkage rate of the epoxy resin composition is less than 5.3%.
12 more elements
Dependencies are inferred from the claim text.