C08G 59/508
Having three nitrogen atoms in the ring
Official title: {having three nitrogen atoms in the ring}
C08G59/508 (Having three nitrogen atoms in the ring) appears on 78 US grants and 73 published applications in this corpus.
Search patents in C08G- Granted patents
- 78
- Published applications
- 73
- Assignees
- 66
- Inventors
- 275
- Latest grant
- 12 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 6 |
| 2011 | 0 | 2 |
| 2012 | 0 | 5 |
| 2013 | 2 | 5 |
| 2014 | 4 | 3 |
| 2015 | 0 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 5 |
| 2018 | 3 | 5 |
| 2019 | 4 | 10 |
| 2020 | 5 | 4 |
| 2021 | 2 | 6 |
| 2022 | 6 | 4 |
| 2023 | 3 | 2 |
| 2024 | 1 | 2 |
| 2025 | 0 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Fast-cure resin formulations with consistent handling characteristics12 Nov 2024US 12,139,575 B2Cytec Industries Inc.
- One-component thermosetting epoxy adhesive with improved adhesion10 Oct 2023US 11,781,048 B2Sika Technology AG
- High-performance triple-crosslinked polymer and preparation method thereof31 Jan 2023US 11,566,112 B2Sichuan Guanmusiyang New Material Technology Co., Ltd.
- Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device24 Jan 2023US 11,560,465 B2Eneos Corporation
- Fast-curing epoxy systems28 Jun 2022US 11,370,876 B2Evonik Operations GmbH
- Epoxy resin composition, resin paste, film-type adhesive, printed wiring board, semiconductor chip package, and electronic device23 Apr 2026US 2026/0109849 A1Asahi Kasei Kabushiki Kaisha
- Nonelectrolytic plating primer composition, laminate, and method for manufacturing same5 Jun 2025US 2025/0179307 A1Iox.Co., Ltd.
- Silver Pastes Used for Manufacturing a Printed Antenna10 Apr 2025US 2025/0115792 A1Henkel AG & Co. KGaA
- Fast-cure resin formulations with consistent handling characteristics6 Mar 2025US 2025/0075028 A1Cytec Industries Inc.
- Process for preparing a reshapable thermoset resin material27 Feb 2025US 2025/0066534 A1Syensqo SA
Most cited
By later US patents
- Epoxy resin compounds in admixture with glycidyl phosphorus compounds and heterocyclic polyamines37US 5,376,453 ASiemens Aktiengesellschaft · 1994
- Process for preparing amide derivatives from haloaminotriazines and acid halides33US 5,288,865 AAmerican Cyanamid Company · 1994
- Curable compositions composite coatings and process for having improved mar and abrasion resistance27US 5,891,981 APPG Industries, Inc. · 1999
- Epoxy resin mixtures containing phosphorus acid/epoxy resin adducts23US 5,648,171 ASiemens Aktiengesellschaft · 1997
- Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts22US 5,587,243 AHoechst Aktiengesellschaft · 1996