Silver Pastes Used for Manufacturing a Printed Antenna

Abstract

The present invention provides silver pastes used for manufacturing a printed antenna, kit-of-parts for preparing a printed antenna for an electronic device comprising three kinds of the silver pastes, use of the silver paste as a via fill ink, a method for preparing a printed antenna circuit with the three kinds of the silver pastes, a printed antenna for an electronic device obtained with the silver pastes, and an electronic device comprising the printed antenna. The silver pastes contain: 2 to 40% by weight of at least one epoxy resin; 0 to 5% by weight of at least one curing agent selected from the group consisting of an amino resin, a low-temperature cationic curing agent, an amine or imidazole capsule curing agent, and combinations thereof; 40 to 90% by weight of at least one filler mixture comprising silver flakes and silver spheres; 10 to 25% by weight of at least one diluent, or 0 to 20% by weight of at least one curing accelerator; and 0 to 5% by weight of at least one coupling agent selected from the group consisting of a silane coupling agent, a titanium-based coupling agent, an aluminum-based coupling agent, and combinations thereof, wherein all the above weight percentages are based on the total weight of the silver paste. The silver pastes of the present invention have high reliability and high conductivity, and have good weather resistance, or good wearing resistance, or no bubbles; and the combination of three kinds of the silver pastes can be excellently used for manufacturing a printed antenna.

Dependencies are inferred from the claim text.