US 5,587,243 A · Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts

Abstract

Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and an aromatic polyamine as the hardener.

Claims17

Dependent claims

An epoxy resin mixture for producing prepregs and composites, comprising:

a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, and an average molecular weight M.sub.n of up to 10,000, which is a reaction product of
(A) a polyepoxy compound with at least two epoxy groups per molecule and
(B) a phosphinic acid anhydride or a phosphonic acid anhydride, or a mixture thereof, and
an aromatic polyamine hardener with the following structure:
##STR2## where one of the R.sup.1 and R.sup.2 groups on each of the three aromatic rings denotes a hydrogen and the other is an alkyl.

2 more elements

Dependencies are inferred from the claim text.

Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts

Life of this patent

Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts

Life of this patent

Abstract

Claims17