Fast-cure resin formulations with consistent handling characteristics
AssigneeCytec Industries Inc.
InventorsAndrew Gibbs, Lewis Williams, Stephen Corden
Life of this patent
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Abstract
The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20° C. and 60° C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.
Claims20
A curable resin comprising, based on a total weight of the curable resin:
- bisphenol A diglycidyl ether in an amount of 60%-70%,
- tetrafunctional epoxy resin in an amount of 15%-25%,
- polyvinyl formyl resin in an amount of 1%-3%,
- polyethersulfone in an amount of 1%-3%,
- dicyandiamide in an amount of 3%-7%,
- solid disubstituted imidazole curative in an amount of 1%-4%, and
- substituted urea catalyst in an amount of 1%-4%;
- wherein the curable resin exhibits:
- (i) a glass transition temperature (Tg) from about 130° C. to about 200° C. when cured;
- (ii) a cure conversion of at least 95% when cured for a duration of no more than 10 minutes at a temperature of no more than 10° C. above the Tg of the curable resin when cured;
- (iii) a phase angle of between 50° and 87°, when heated from 20° C. to 60° C.;
- and
- (iv) a complex modulus of between about 100 Pa·s and about 10,000,000 Pa·s between 20 and 60° C.
A curable resin comprising, based on a total weight of the curable resin:
- epoxy phenol novolac in an amount of 65%-75%,
- polyvinyl formyl resin in an amount of 3%-7%,
- solid epoxy resin in an amount of 4%-8%,
- dicyandiamide in an amount of 3%-7%,
- bisphenol A diglycidyl ether in an amount of 5%-15%, and
- solid disubstituted imidazole curative in an amount of 1%-4%;
- wherein the curable resin exhibits:
- (i) a glass transition temperature (Tg) from about 130° C. to about 200° C. when cured;
- (ii) a cure conversion of at least 95% when cured for a duration of no more than 10 minutes at a temperature of no more than 10° C. above the Tg of the curable resin when cured;
- iii) a phase angle of between 50° and 87°, when heated from 20° C. to 60° C.;
- and
- iv) a complex modulus of between about 100 Pa·s and about 10,000,000 Pa·s between 20 and 60° C.
Dependencies are inferred from the claim text.