Epoxy resin compounds in admixture with glycidyl phosphorus compounds and heterocyclic polyamines

An epoxy resin composition for manufacturing prepregs and composite materials, comprising the following constituents:

• (A) an aromatic and/or heterocyclic polyglycidyl compound that is free of phosphorous;
• (B) an epoxy-group-containing phosphorous compound of the following structure:
• ##STR3## with m=0 or 1, n=0,1 or 2 and o=1, 2 or 3, where the following holds:
• m+n+o=3, and with p=0, 1 or 2;
• X signifies a free electron pair or an O- or S-atom linked via a double bond;
• R signifies an alkyl residue having 1 to 4 C-atoms;
• alkenyl residue having 2 to 3 C-atoms;
• aryl residue;
• aryl alkyl residue;
• dialkyl-amino residue or alkyl-aryl-amino residue or 3- trialkylsilylpropyl residue;
• R being linked directly or via O or S;
• R' denotes a bridge of O, S, phenylene, dioxyphenylene, dioxynaphthylene, (CH.sub.2).sub.r, O--(CH.sub.2).sub.r or O--(CH.sub.2).sub.r --O with r=1 to 3;
• and
• A.sup.1 and A.sup.2, which can be the same or different, denote a single bond or a bridge according to the grouping R';
• and
• (C) an aromatic polyamine as a curing agent of the following structure:
• ##STR4## where on each of the three aromatic partial structures, one of the residues R.sup.1 and R.sup.2 respectively denotes H and the other alkyl.