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US 2025/0066534 A1Published application
Process for preparing a reshapable thermoset resin material
AssigneeSyensqo SA
InventorsRakhi SOOD, Vinayak VALODKAR, Hemang DARJI, Xavier REVEST
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Abstract
A process for preparing a reshapable thermoset resin material comprising curing epoxy resin wherein curing is carried out with (a) at least one imidazole compound and (b) at least one benzotriazole compound.
Claims12
A process for preparing a reshapable thermoset resin material comprising mixing epoxy resin with (a) at least one imidazole compound and (b) at least one benzotriazole compound to form a mixture, and curing the mixture.
Dependencies are inferred from the claim text.