Back to results
US 5,969,036 AGranted
Epoxy-containing die-attach compositions
AssigneeThe Dexter Corporation
InventorStephen M. Dershem
Life of this patent
Estimating the term…
Abstract
In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.
Claims30
A composition for attaching a semiconductor device to a substrate, said composition comprising:
- a liquid monomer vehicle comprising at least one hydrophobic cyanate ester monomer and at least one epoxy monomer;
- a filler;
- 50 to 1500 ppm, on a metals basis, relative to the cyanate ester monomer, of a metal catalyst;
- and
- 0.5 to 10 weight percent, based on the epoxy monomer, of an imidazole,
- wherein said monomer vehicle has low levels of hydrolyzable chloride.
3 more elements
A composition for attaching a semiconductor device to a substrate, said composition consisting essentially of:
- a liquid monomer vehicle comprising at least one hydrophobic cyanate ester monomer and at least one epoxy monomer;
- a filler;
- 50 to 1500 ppm, on a metals basis, relative to the cyanate ester monomer, of a metal catalyst;
- and
- 0.5 to 10 weight percent, based on the epoxy monomer, of an imidazole,
- wherein said monomer vehicle has low levels of hydrolyzable chloride.
3 more elements
Dependencies are inferred from the claim text.