C04B 2237/54
Oxidising the surface before joining
C04B2237/54 (Oxidising the surface before joining) appears on 72 US grants and 55 published applications in this corpus.
Search patents in C04B- Granted patents
- 72
- Published applications
- 55
- Assignees
- 53
- Inventors
- 192
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 2 |
| 2004 | 0 | 2 |
| 2005 | 2 | 1 |
| 2006 | 2 | 0 |
| 2007 | 0 | 3 |
| 2008 | 0 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 0 |
| 2011 | 0 | 3 |
| 2012 | 0 | 4 |
| 2013 | 2 | 1 |
| 2014 | 4 | 3 |
| 2015 | 2 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 5 |
| 2020 | 0 | 4 |
| 2021 | 3 | 6 |
| 2022 | 2 | 4 |
| 2023 | 2 | 4 |
| 2024 | 3 | 1 |
| 2025 | 1 | 0 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite body comprising silicon carbide and method for producing same11 Aug 2026US 12,703,176 B2National Institute of Advanced Industrial Science and Technology
- Adapter element for connecting an electronics component to a heat sink element, system comprising an adapter element of this kind, and method for producing an adapter element of this kind20 Jan 2026US 12,531,390 B2Rogers Germany GmbH
- Semiconductor device13 Jan 2026US 12,525,504 B2Fuji Electric Co., Ltd.
- Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate22 Apr 2025US 12,284,766 B2BYD Company Limited
- Metal ceramic substrate and method for manufacturing such metal ceramic substrate27 Aug 2024US 12,075,557 B2Rogers Germany GmbH
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
- Composite body comprising silicon carbide and method for producing same9 May 2024US 2024/0149565 A1National Institute of Advanced Industrial Science and Technology
- Copper-ceramic substrate14 Dec 2023US 2023/0399267 A1Aurubis Stolberg GmbH & Co. KG
- Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate24 Aug 2023US 2023/0269879 A1BYD Company Limited
- Semiconductor device27 Jul 2023US 2023/0238299 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992
- Bonds between metal and a non-metallic substrate69US 3,993,411 AGeneral Electric Company · 1976
- Sealing members for alumina arc tubes and method of making same44US 5,725,827 AOsram Sylvania Inc. · 1998
- Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof39US 4,129,243 AGeneral Electric Company · 1978