Back to results
US 2023/0399267 A1Published application
Copper-ceramic substrate
AssigneeAurubis Stolberg GmbH & Co. KG
InventorsBenjamin CAPPI, Helge LEHMANN
Life of this patent
Estimating the term…
Abstract
The invention relates to a copper-ceramic substrate comprising a ceramic support and at least one copper layer bonded to a surface of the ceramic support, the copper layer having a Cu content of at least 99.5% Cu, the copper layer having an Ag content of at least 50 ppm, and the copper layer having an Ag content of not more than 3000 ppm.
Claims9
1-10. (canceled)
A copper-ceramic substrate, comprising:
- a ceramic carrier;
- and
- at least one copper layer bonded to a corresponding at least one surface of the ceramic carrier,
- wherein the at least one copper layer has a Cu content of at least 99.5%,
- wherein the at least one copper layer has an Ag content of at least 50 ppm,
- wherein the Ag content of the at least one copper layer is not more than 3000 ppm,
- wherein the at least one copper layer has a P content of not more than 30 ppm, and
- wherein the P content of the at least one copper layer is at least 0.1 ppm.
5 more elements
Dependencies are inferred from the claim text.