Adapter element for connecting an electronics component to a heat sink element, system comprising an adapter element of this kind, and method for producing an adapter element of this kind

A system (1) for cooling an electronic component (30) including the electronic component (30), which has a first connection region (31), a second connection region (32) and at least one active element region (5) arranged between the first connection region (31) and the second connection region (32), and including an adapter element (10) for connecting the electronic component (30) to a heat sink element (20), the adapter element (10) further comprising:

• an insulation layer (15) extending along a main extension plane (HSE), and
• at least a first web element (11) and a second web element (12),
• which are arranged next to each other in a direction parallel to the main extension plane (HSE), forming a free area (13) between the first web element and the second web element,
• which, in the assembled state, are arranged between the insulating layer (15) and the electronic component (30) in a direction running perpendicular to the main extension plane (HSE), and
• on whose front sides (18) facing away from the insulating layer (15) the electronic component (30) is arranged in the assembled state,
• wherein the first web element (11) and the second web (12) element are part of a metal layer, the metal layer having a first thickness, wherein the first thickness has a value between 0.1 and 2 mm, wherein a distance (A) between the first web element (11) and the second web element (12), measured in a plane parallel to the main extension plane (HSE), has a value between 100 μm and 300 μm, the system (1) further comprising the heat sink element (20), which is connected to the insulation layer (15) on its underside (US) facing away from the first web element (11) and the second web element (12), the adapter element (10) being arranged between the electronic component (30) and the heat sink element (20) in the assembled state characterized in that a region free of web elements between the insulating layer and the electrical component is formed, wherein a distance between the first web element and the second web element is such that the at least one active element region can be bridged with the free area between the first web element and the second web element.