Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
AssigneeBYD Company Limited
InventorsWei ZHOU, Qiang XU, Caicai XIE
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Abstract
A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.
Claims18
A method for preparing a ceramic copper clad laminate, comprising following steps:
- forming a copper oxide layer on a surface of a copper material;
- thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms into the copper material;
- removing the copper oxide layer on the thermally treated copper material;
- and
- soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain the ceramic copper clad laminate.
A ceramic copper clad laminate, comprising a ceramic substrate, an active metal soldering layer, and a copper layer laminated in sequence, wherein, the copper layer contains oxygen element.
Dependencies are inferred from the claim text.