US 3,993,411 A · Bonds between metal and a non-metallic substrate

Abstract

A direct bond between metallic members and non-metallic members is achieved at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. A metal member such as copper, for example, is placed in contact with a non-metallic substrate, such as alumina, the metal member and the substrate are heated to a temperature slightly below the melting of the metal, e.g., between approximately 1065.degree. and 1080.degree. C. for copper, with the heating being performed in a reactive atmosphere, such as an oxidizing atmosphere, for a sufficient time to create a copper-copper oxide eutectic melt which, upon cooling, bonds the copper to the substrate. Various metals, non-metals and reactive gases are described for direct bonding.

Claims6

Dependent claims

A bonded structure comprising:

a metallic member constituting a metallic substance selected from the group consisting of copper, nickel, cobalt, iron, chromium, copper-nickel, nickel-cobalt, copper-chromium, copper-cobalt, iron-nickel, silver-gold and beryllium-copper;
a non-metallic member selected from the group consisting of alumina, beryllia, and fused silica;
and a bond between said metallic member and said non-metallic member comprising a fused eutectic composition comprising a mixture of said metallic substance and a reactive gas selected from the group consisting of a sulfur-bearing gas and a phosphorus-bearing gas, said mixture being substantially devoid of oxides of said metallic substance.

Dependencies are inferred from the claim text.

Bonds between metal and a non-metallic substrate

Life of this patent

Bonds between metal and a non-metallic substrate

Life of this patent

Abstract

Claims6