Metal ceramic substrate and method for manufacturing such metal ceramic substrate

A carrier substrate (1) for electrical components, comprising

• an insulation layer (10),
• a component metallization (20) which is formed on a component side (BS) and has a first primary structuring (21), and
• a cooling part metallization (30) which is formed on a cooling side (KS) opposite the component side (BS) and has a second primary structuring (31),
• wherein the insulation layer (10), the component metallization (20) and the cooling part metallization (30) are arranged one above the other along a stacking direction (S), and
• wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions, and
• characterized in that the cooling part metallization (30) has a second secondary structuring (32),
• wherein the second primary structuring (31) has a second depth (T2) and a second width (B2) and the second secondary structuring (32) has a further second depth (T2′) and a further second width (B2′),
• wherein the second depth (T2) is larger or smaller than the further second depth (T2′) and/or the second width (B2) is larger or smaller than the further second width (B2′).