B81C 99/007
Marking
Official title: {Marking}
B81C99/007 (Marking) appears on 8 US grants and 11 published applications in this corpus.
Search patents in B81C- Granted patents
- 8
- Published applications
- 11
- Assignees
- 9
- Inventors
- 22
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 3 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 3 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
By publication year.
Recent patents
- Plate30 Apr 2024US 11,970,681 B2Ushio Denki Kabushiki Kaisha
- Package-on-package (POP) type semiconductor packages21 Mar 2023US 11,610,871 B2Samsung Electronics Co., Ltd.
- Alignment mark and semiconductor device, and fabrication methods thereof29 Jun 2021US 11,049,816 B2Ningbo Semiconductor International Corporation
- Method of arranging a plurality of semiconductor structural elements on a carrier and carrier comprising a plurality of semiconductor structural elements13 Aug 2019US 10,381,311 B2OSRAM Opto Semiconductors GmbH
- Alignment pattern for package singulation25 Dec 2018US 10,163,807 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package-on-package (pop) type semiconductor packages13 Jul 2023US 2023/0223387 A1Samsung Electronics Co., Ltd.
- Semiconductor device9 Sep 2021US 2021/0280527 A1Ningbo Semiconductor International Corporation
- Plate19 Aug 2021US 2021/0253988 A1Ushio Denki Kabushiki Kaisha
- Package-on-package (pop) type semiconductor packages11 Mar 2021US 2021/0074691 A1Samsung Electronics Co., Ltd.
- Alignment mark and semiconductor device, and fabrication methods thereof21 May 2020US 2020/0161251 A1Ningbo Semiconductor International Corporation
Most cited
By later US patents
- Method of aligning structures on opposite sides of a wafer8US 6,555,441 B2DALSA Semiconductor Inc. · 2003
- Alignment pattern for package singulation6US 10,163,807 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Method of arranging a plurality of semiconductor structural elements on a carrier and carrier comprising a plurality of semiconductor structural elements1US 10,381,311 B2OSRAM Opto Semiconductors GmbH · 2019