Alignment mark and semiconductor device, and fabrication methods thereof

A method for forming a semiconductor device, comprising:

• providing a first base substrate;
• forming a plurality of alignment marks on the first base substrate;
• dicing the first base substrate to form a plurality of alignment dies, wherein each alignment die includes a diced first base substrate and at least one alignment mark diced from the plurality of alignment marks on the diced first base substrate;
• providing a second base substrate for aligning;
• forming a bonding film on the second base substrate;
• attaching an alignment die of the plurality of alignment dies to the bonding film on an alignment region of the second base substrate using a die attach process;
• and
• aligning and bonding a third base substrate with a surface of the second base substrate on which the alignment die is attached.

A method for forming an alignment mark, comprising:

• providing a semiconductor material base substrate;
• forming a plurality of alignment marks on the semiconductor material base substrate, wherein the plurality of alignment marks are distributed throughout the semiconductor material base substrate;
• dicing the semiconductor material base substrate to form a plurality of alignment dies to form a plurality of alignment marks for a carrier wafer, and
• attaching a chip on a surface of the second base substrate on which the alignment die is attached.