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US 2021/0280527 A1Published application
Semiconductor device
AssigneeNingbo Semiconductor International Corporation
InventorMengbin LIU
Life of this patent
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Abstract
A semiconductor device is provided. The semiconductor device includes: a plurality of alignment dies, each including a diced first base substrate and at least one alignment mark on the diced first base substrate; a second base substrate; and a bonding film on the second base substrate. An alignment die of the plurality of alignment dies are attached on the bonding film on an alignment region of the second base substrate for aligning the second base substrate.
Claims9
A semiconductor device, comprising:
- a plurality of alignment dies, each including a diced first base substrate and at least one alignment mark on the diced first base substrate;
- a second base substrate;
- and
- a bonding film on the second base substrate, wherein:
- an alignment die of the plurality of alignment dies are attached on the bonding film on an alignment region of the second base substrate for aligning the second base substrate.
2 more elements
Dependencies are inferred from the claim text.