Alignment pattern for package singulation

A method, comprising:

• attaching a first side of a packages structure to a dicing tape by connectors disposed on the first side of the packages structure;
• scanning a second side of the packages structure for an alignment pattern;
• detecting the alignment pattern in a first package area of the packages structure, the first package area comprising an embedded die and a redistribution structure disposed between the embedded die and the connectors, the alignment pattern overlapping a metal feature of the redistribution structure;
• aligning a cutting device to a cut-line in a non-package area of the packages structure based on a predetermined distance from the alignment pattern;
• and
• singulating one or more packages from the packages structure, wherein a first package of the one or more packages includes the first package area and the alignment pattern.

A integrated fan-out (InFO) package comprising:

• a first insulating layer having a first laser marking;
• an alignment pattern proximate to a front side of the first insulating layer;
• an encapsulated die over the front side of the first insulating layer and encapsulated by an encapsulant;
• a redistribution structure over the die, the redistribution structure including a metal feature, wherein the alignment pattern overlaps with the metal feature of the redistribution structure, and wherein the encapsulant is interposed between the alignment pattern and the redistribution structure;
• and
• a plurality of connectors disposed over the redistribution structure on a top of the package, a first connector of the plurality of connectors being electrically coupled to the encapsulated die.