B81C 99/0065
Process control
Official title: {Process control; Yield prediction}
B81C99/0065 (Process control) appears on 50 US grants and 58 published applications in this corpus.
Search patents in B81C- Granted patents
- 50
- Published applications
- 58
- Assignees
- 40
- Inventors
- 129
- Latest grant
- 6 Dec 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 2 |
| 2003 | 2 | 4 |
| 2004 | 2 | 3 |
| 2005 | 2 | 12 |
| 2006 | 2 | 2 |
| 2007 | 5 | 6 |
| 2008 | 4 | 6 |
| 2009 | 6 | 3 |
| 2010 | 6 | 3 |
| 2011 | 1 | 0 |
| 2012 | 0 | 3 |
| 2013 | 1 | 2 |
| 2014 | 4 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 3 | 0 |
| 2018 | 1 | 4 |
| 2019 | 0 | 2 |
| 2020 | 3 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Atomic-scale e-beam sculptor6 Dec 2022US 11,518,674 B2UT-Battelle, LLC
- Plasma health determination in semiconductor substrate processing reactors16 Feb 2021US 10,920,320 B2APPLIED Materials.Inc.
- Micro-electro-mechanical-systems processing method, and micro-electro-mechanical-systems processing apparatus26 May 2020US 10,662,059 B2Hitachi, Ltd.
- MEMS manufacturing method and MEMS manufacturing apparatus31 Mar 2020US 10,605,824 B2Hitachi, Ltd.
- MEMS manufacturing system and MEMS manufacturing method21 Jan 2020US 10,538,429 B2Hitachi, Ltd.
- Quartz crystal microbalance (qcm) sensor having rapid registration response3 Oct 2024US 2024/0329001 A1Inficon GmbH
- Atomic-scale e-beam sculptor6 Aug 2020US 2020/0247667 A1UT-Battelle, LLC
- Mems Manufacturing System and Mems Manufacturing Method21 Mar 2019US 2019/0084830 A1Hitachi, Ltd.
- Micro-electro-mechanical-systems processing method, and micro-electro-mechanical-systems processing apparatus28 Feb 2019US 2019/0062157 A1Hitachi, Ltd.
- Plasma health determination in semiconductor substrate processing reactors20 Dec 2018US 2018/0366378 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system122US 5,910,011 AAPPLIED Materials.Inc. · 1999
- Control of solid state dimensional features113US 6,464,842 B1President and Fellows of Harvard College · 2002
- Method and devices for detecting the end point of plasma process70US 5,980,767 ATokyo Electron Limited · 1999
- High throughput screening of crystallization of materials57US 7,052,545 B2California Institute of Technology · 2006
- Method and devices for detecting the end point of plasma process54US 5,728,253 ATokyo Electron Limited · 1998