B81C 3/004
Active alignment, i.e. moving the elements in response to the detected position
Official title: {Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators}
B81C3/004 (Active alignment, i.e. moving the elements in response to the detected position) appears on 38 US grants and 48 published applications in this corpus.
Search patents in B81C- Granted patents
- 38
- Published applications
- 48
- Assignees
- 34
- Inventors
- 92
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 2 | 2 |
| 2009 | 0 | 2 |
| 2010 | 4 | 6 |
| 2011 | 3 | 4 |
| 2012 | 2 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 3 | 2 |
| 2016 | 2 | 1 |
| 2017 | 1 | 3 |
| 2018 | 4 | 2 |
| 2019 | 0 | 3 |
| 2020 | 3 | 3 |
| 2021 | 4 | 4 |
| 2022 | 4 | 3 |
| 2023 | 1 | 1 |
| 2024 | 1 | 3 |
| 2025 | 2 | 3 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Rosette strain gage and method of fabrication21 Apr 2026US 12,607,526 B1Piezo-Metrics Inc
- Method and arrangement for assembly of microchips into a separate substrate6 Jan 2026US 12,515,947 B2Sensible Holding B.V.
- Offset alignment and repair in micro device transfer25 Nov 2025US 12,482,686 B2VueReal Inc.
- Offset alignment and repair in micro device transfer5 Aug 2025US 12,381,104 B2VueReal Inc.
- System and method for machine-learning enabled micro-assembly control with the aid of a digital computer6 Feb 2024US 11,893,327 B2Xerox Corporation
- Mems micromirror unit and production thereof9 Jul 2026US 2026/0194744 A1
- Offset alignment and repair in micro device transfer22 May 2025US 2025/0167032 A1VueReal Inc.
- Offset alignment and repair in micro device transfer22 May 2025US 2025/0167033 A1VueReal Inc.
- Gear assembly, timepiece, and gear assembly manufacturing method27 Mar 2025US 2025/0103005 A1Casio Computer Co., Ltd.
- High-precision alignment method for producing a device, and device8 Aug 2024US 2024/0262683 A1
Most cited
By later US patents
- Assembling stacked substrates that can form cylindrical inductors and adjustable transformers11US 7,728,427 B2LCtank LLC · 2010
- Alignment methods in fluid-filled MEMS displays11US 9,229,222 B2Pixtronix, Inc. · 2016
- Assembling stacked substrates that can form 3-D structures7US 7,811,854 B2MetaMEMS LLC · 2010
- Alignment methods in fluid-filled MEMS displays7US 9,274,333 B2Pixtronix, Inc. · 2016
- Methods and systems for wafer bonding alignment compensation6US 10,886,256 B2Yangtze Memory Technologies Co., Ltd. · 2021