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US 12,482,686 B2Granted
Offset alignment and repair in micro device transfer
AssigneeVueReal Inc.
InventorGholamreza Chaji
Life of this patent
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Abstract
This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
Claims6
A method to populate void micro devices, the method comprising:
- generating a map of the void microdevices;
- forming a new pad on top of an existing pad on a system substrate for any void microdevices in the map wherein the new pad is taller than the existing pad;
- aligning a microdevice on a donor substrate with the new pad;
- transferring the aligned micro device to the new pad;
- and
- securing the transferred micro device by the new pad.
3 more elements
Dependencies are inferred from the claim text.