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US 12,381,104 B2Granted
Offset alignment and repair in micro device transfer
AssigneeVueReal Inc.
InventorGholamreza Chaji
Life of this patent
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Abstract
This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
Claims14
A method to operate multiple transfer heads, the method comprising:
- aligning each transfer head with an associated area in a system substrate;
- transferring a set of microdevices in a donor substrate from at least one transfer head into the system substrate, the at least one transfer head being aligned with the donor substrate and picking the donor substrate;
- moving each transfer head or the system substrate to enable an offset between each transfer head and the system substrate;
- and
- having a new set of microdevices from the at least one transfer head into a new area in the system substrate, wherein alignment marks on the donor substrate are aligned with corresponding alignment marks in the system substrate.
2 more elements
Dependencies are inferred from the claim text.