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US 2025/0167033 A1Published application
Offset alignment and repair in micro device transfer
AssigneeVueReal Inc.
InventorGholamreza CHAJI
Life of this patent
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Abstract
This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
Claims17
A method to correct misalignment in a transfer process of micro devices from a donor substrate to a system substrate, the method comprising:
- comparing a location of at least one of the transferred microdevices from the donor substrate into the system substrate in a first transfer of the microdevices against an intended position of the microdevice in a next transfer on the system substrate;
- calculating an offset vector based on a new intended location in the system substrate for a next transfer of the microdevices and a extracted misalignment information from the first transfer of the microdevices;
- and
- using the offset vector to execute the next transfer.
1 more element
Dependencies are inferred from the claim text.