B81C 2203/055
Using the surface tension of fluid solder to align the elements
Official title: using the surface tension of fluid solder to align the elements
B81C2203/055 (Using the surface tension of fluid solder to align the elements) appears on 6 US grants and 6 published applications in this corpus.
Search patents in B81C- Granted patents
- 6
- Published applications
- 6
- Assignees
- 5
- Inventors
- 12
- Latest grant
- 26 May 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 0 |
By publication year.
Recent patents
- Method for self-aligning solder-attached mems die to a mounting surface26 May 2020US 10,662,057 B2DunAn Microstaq, Inc.
- Method for self-aligning solder-attached MEMS die to a mounting surface29 Jan 2019US 10,189,706 B2DunAn Microstaq, Inc.
- Die bond design for medium pressure sensor31 Jul 2018US 10,035,703 B2Continental Automotive Systems, Inc.
- Method and system for improving alignment precision of parts in MEMS29 Apr 2014US 8,707,553 B2International Business Machines Corporation
- Method for disposing a component9 Apr 2013US 8,414,976 B2Panasonic Corporation
- Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface28 Mar 2019US 2019/0092629 A1DunAn Microstaq, Inc.
- Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface28 Mar 2019US 2019/0092630 A1DunAn Microstaq, Inc.
- Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface10 May 2018US 2018/0127269 A1DunAn Microstaq, Inc.
- Die bond design for medium pressure sensor2 Apr 2015US 2015/0091107 A1Continental Automotive Systems, Inc.
- Method for disposing a component25 Oct 2012US 2012/0269971 A1Panasonic Corporation
Most cited
By later US patents
- Method for self-aligning solder-attached MEMS die to a mounting surface1US 10,189,706 B2DunAn Microstaq, Inc. · 2019
- Method for disposing a component1US 8,414,976 B2Panasonic Corporation · 2013
- Method and system for improving alignment precision of parts in MEMS1US 8,707,553 B2International Business Machines Corporation · 2014