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US 10,189,706 B2Granted
Method for self-aligning solder-attached MEMS die to a mounting surface
AssigneeDunAn Microstaq, Inc.
InventorsWayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
Life of this patent
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Abstract
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
Claims4
A method of attaching a MEMS die to a surface, the method comprising:
- placing solder mask having a centrally formed flow area on a solder surface of a body;
- centering and rotationally aligning a solder perform on the solder surface of the body within the flow area of the solder mask;
- centering and rotationally aligning a MEMS die on the solder preform;
- and
- heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance and the MEMS die is centered within the flow area of the solder mask;
- wherein the solder surface of the body is substantially circular and the solder preform is substantially rectangular.
3 more elements
Dependencies are inferred from the claim text.