Method for self-aligning solder-attached mems die to a mounting surface
AssigneeDunAn Microstaq, Inc.
InventorsWayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
Life of this patent
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Abstract
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
Claims4
A method of attaching a MEMS die to a surface, the method comprising:
- forming a solder well in a center of a solder surface of a body;
- centering and rotationally aligning a solder perform within the solder well;
- centering and rotationally aligning a MEMS die on the solder preform;
- and
- heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered within the solder well;
- wherein the solder surface of the body is substantially circular and the solder preform is substantially rectangular.
A method of attaching a MEMS die to a surface, the method comprising:
- forming a solder well in a center of a solder surface of a body, the solder well including a lip formed therein and extending circumferentially around a bore in the body;
- centering and rotationally aligning a solder perform within the solder well;
- centering and rotationally aligning a MEMS die on the solder preform;
- and
- heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered within the solder well;
- wherein the lip defines a barrier over which the molten solder will not flow during the heating step, the lip thus preventing the molten solder from flowing into the bore.
Dependencies are inferred from the claim text.